Semiconductor memory circuit device and method for fabricating a semiconductor memory device circuit

ABSTRACT

In a semiconductor memory circuit device wherein each memory cell is constituted by a series circuit of a memory cell selecting MISFET and an information storing capacitor of a stacked structure, there are present in a first region as a memory cell array region a first MISFET having a gate electrode and source and drain regions; first and second capacity electrodes and a dielectric film extending onto a first insulating film on the gate electrode; a second insulating film positioned on the second capacity electrode; and a first wiring positioned on the second insulating film, while in a second region as a peripheral circuit region there are present a second MISFET having a gate electrode and source and drain regions; a first insulating film on the gate electrode; a third insulating film on the first insulating film; a second insulating film on the third insulating film; and a second wiring on the second insulating film.

This application is a Continuation application of application Ser. No.08/327,861, filed Oct. 18, 1994, U.S. Pat. No. 5,631,182 which is aDivisional application of application Ser. No. 08/104,014, filed Aug.10, 1993, U.S. Pat. No. 5,389,558 which is a Divisional application ofapplication Ser. No. 07/799,541, filed Nov. 27, 1991 U.S. Pat. No.5,237,187.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor memory circuit device,particularly a technique effective in its application to a DRAM (DynamicRandom Access Memory).

A memory cell for holding 1 bit of information in a DRAM is constitutedby a series circuit comprising a memory cell selecting MISFET and aninformation storing capacitor. A gate electrode in the memory cellselecting MISFET is connected to a word line extending in a rowdirection. One semiconductor region of the memory cell selecting MISFETis connected to one of complementary data lines which are first metallicwiring layer, while the other semiconductor region is connected to oneelectrode of the information storing capacitor. To the other electrodeof the information storing capacitor is applied a predetermined fixedpotential. A word line is composed of two layers which are the gateelectrode of the memory cell selecting MISFET and a second metallicwiring layer.

This type of a DRAM tends to be increased in its integration density forattaining a larger capacity and reduced in the size of each memory cell.When the memory cell size is reduced, the size of the informationstoring capacitor is also reduced, so that the amount of an electriccharge which serves as information is also decreased. This decrease inthe amount of an electric charge stored causes deterioration of theα-ray soft error resistance. In particular, in a DRAM of 1M bits orlarger capacity, the improvement of the α-ray soft error resistance isone of important technical subjects.

Along such technical subject there is now a tendency to the adoption ofa stacked structure (STC structure)for the information storing capacitorof each memory cell in a DRAM. The information storing capacitor isconstituted by laminating a lower electrode layer, a dielectric film andan upper electrode layer successively in this order on a semiconductorsubstrate. The lower electrode layer is connected to the othersemiconductor region of the memory cell selecting MISFET and is extendedup to above the gate electrode. The lower electrode layer is patternedto have a predetermined plane shape by the application of aphotolithographic technique and an etching technique to apolycrystalline silicon film deposited according to a CVD method. Thedielectric film is provided along upper and side faces of the lowerelectrode layer. The upper electrode layer is provided on the surface ofthe dielectric films and it is constituted integrally with the upperelectrode layer of the information storing capacitor of a stackedstructure in other memory cells adjacent thereto and is used a commonplate electrode. Like the lower electrode layer, the upper electrodelayer is formed using a polycrystalline silicon film.

In order to attain a higher integration density and a larger capacity inthe DRAM of such a stacked structure there has been developed atechnique of forming the lower electrode layer in a fin shape, orextending the lower electrode layer vertically upwards, or using theside faces of the lower electrode layers positively as a capacitanceportion. Such DRAM is shown, for example, in U.S. Pat. No. 4,742,018 orIEDM 88, pages 592-595.

SUMMARY OF THE INVENTION

According to a study made by the present inventor, it turned out thatthe aforementioned DRAM involved the following problems.

In the DRAM in question, since the lower electrode layer in theinformation storing capacitor of each memory cell extends verticallyupwards, the difference in height between a memory cell array region (orarea) and a peripheral circuit region (or area) is very large.Particularly, such difference in height is marked between the portionwhere the gate electrode of each memory cell selecting MISFET and theupper and lower electrode layers of the information storing capacitor inthe memory cell array region overlap each other and the portion ofsource and drain regions of each MISFET in the peripheral circuitregion. As to the difference in height, note is taken of the differencein height at the time of formation of the first metallic wiring layer.

In the case of such a large difference in height between the memory cellarray region and the peripheral circuit region, both regions are notpositioned within the depth of focus of an aligner in the exposureprocess, thus making it impossible to process both regions at a time.

The dept of focus of an aligner for forming a pattern of 0.5 μm or so isconsidered to be 1.5 μm or so. Therefore, the difference in heightbetween the memory cell array and the peripheral circuit region must bekept to a value not larger than 0.75 μm from a predetermined referenceposition.

The difference in height mentioned above sometimes causes a partial etchresidue in the etching process or a base layer damage due tooveretching, thus leading to deterioration of the product yield.

Moreover, in the exposure process and the etching process, since theprocessing accuracy is different between the memory cell array regionand the peripheral circuit region, there occur variations in sizebetween both regions, thus causing decrease of the processing margin andthe resultant lowering of the integration density.

Further, the difference in height in question may cause breaking of ametallic (e.g. aluminum) line which spans the memory cell array regionand the peripheral circuit region, thus resulting in deterioration ofthe product yield or of reliability.

Objects of the present invention reside in:

(1) providing a technique capable of improving the integration densityin a semiconductor memory circuit device;

(2) providing a technique capable of improving the product yield in asemiconductor memory circuit device;

(3) providing a technique capable of improving the electricalreliability in a semiconductor memory circuit device;

(4) providing a technique capable of improving the processing margin ina semiconductor memory circuit device; and

(5) providing a technique capable of shortening the fabrication processin a semiconductor memory circuit device.

The above and other objects and novel features of the present inventionwill become more apparent from the following description and theaccompanying drawings.

The following are brief summaries of typical inventions disclosedherein.

(1) In a semiconductor memory circuit device including memory cells eachconstituted by a series circuit of a memory cell selecting MISFET and aninformation storing capacitor of a stacked structure, there are presentin a first region as a memory cell array region a first MISFET having agate electrode and source and drain regions, first and second capacityelectrodes and a dielectric film extending on a first insulating filmabove the gate electrode, a second insulating film positioned on thesecond capacity electrode, and a first wiring positioned on the secondinsulating film, while in a second region as a peripheral circuit regionthere are present a second MISFET having a gate electrode and source anddrain regions, a first insulating film on the gate electrode, a thirdinsulating film on the first insulating film, a second insulating filmon the third insulating film, and a second wiring on the secondinsulating film.

(2) In a semiconductor memory circuit device having a memory cell arrayformed in a first region of a main surface of a semiconductor substrateand a peripheral circuitry formed in a second region thereof, thedifference between the distance of a second wiring connected to a sourceor drain region of a MISFET positioned in the second region from theback of the semiconductor substrate and the distance of a first wiringin the same layer as the second wiring positioned in the first regionfrom the back of the semiconductor substrate is not larger than 1.5 μm.

(3) In a semiconductor memory circuit device having a memory cell arrayof memory cells each comprising a first MISFET and an informationstoring capacitor connected in series with each other and arranged in amatrix form and also having a peripheral circuitry composed of pluralsecond MISFETs there are performed:

(a) a step of forming a first gate electrode of a first MISFET and asecond a gate electrode of a second MISFET in first and second regionson a first conductivity type semiconductor substrate;

(b) a step of forming first semiconductor regions of a secondconductivity type in the first and second regions in self-alignmentmanner with respect to the first and second gate electrodes;

(c) a step of forming a side wall insulating film at end portions of thefirst and second gate electrodes;

(d) a step of forming a second semiconductor region of a secondconductivity type in self-alignment manner with respect to the secondgate electrode and the side wall insulating film;

(e) a step of forming a third insulating film on the first and secondregions provided on the semiconductor substrate;

(f) a step of forming a first opening in the third insulating film forexposing one of the source and drain regions of the first MISFET;

(g) a step of forming a first capacity electrode of the informationstoring capacitor for contact with one of the source and drain regionsof the first MISFET through the first opening;

(h) a step of forming a dielectric film and a second capacity electrodeof the information storing capacitor on the first capacity electrode;

(i) a step of forming a second insulating film on the third insulatingfilm in the first and second regions of the semiconductor substrate; and

(j) a step of forming a wiring layer on the second insulating film inthe first and second regions.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a principal portion of a DRAM according toan embodiment I of the present invention;

FIG. 2 is a partially sectional plan view of a resin molded typesemiconductor device with the DRAM sealed therein;

FIG. 3 is a chip layout diagram of the DRAM;

FIG. 4 is an equivalent circuit diagram of a principal portion of theDRAM;

FIG. 5 is a plan view of a principal portion of the DRAM;

FIGS. 6 to 13 are sectional views fabrication processes for the DRAM;

FIG. 14 is a sectional view of a principal portion of a DRAM accordingto another embodiment II of the present invention;

FIG. 15 is a sectional view of a principal portion of a DRAM accordingto a further embodiment III of the present invention; and

FIGS. 16 to 20 are sectional views showing fabrication processes for theDRAM of the embodiment III.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be described below with respect to anembodiment thereof applied to a DRAM wherein each memory cell isconstituted by a series circuit consisting of a memory cell selectingMISFET and an information storing capacitor of a stacked structure.

In all of the drawings for explanation of this embodiment, the portionshaving the same functions are indicated by the same reference numeralsand repeated explanation thereof will be omitted.

(Embodiment I)

FIG. 2 (a partially sectional plan view) illustrates a resin molded typesemiconductor device with a DRAM according to an embodiment I of thepresent invention sealed therein.

As shown in the same figure, the DRAM (semiconductor pellet), indicatedat 1, is sealed by a resin molded type semiconductor device 2 of an SOJ(Small Out-line J-bend) type. The DRAM 1 is mounted through an adhesiveonto the surface of a tab 3A of the resin molded type semiconductordevice 2.

The DRAM 1, which has a large capacity of 4M bits, is sealed in theresin molded type semiconductor device 2 of 350 mils. On a main surfaceof the DRAM 1 there is disposed a memory cell array comprising aplurality of memory cells arranged in a matrix form. In the otherportion of the main surface of the DRAM 1 than the memory cell arraythere are disposed a direct peripheral circuitry and an indirectperipheral circuitry. The direct peripheral circuitry is for directlycontrolling information writing and reading operations for each memorycell and includes a row address decoder circuit, a column addressdecoder circuit and a sense amplifier circuit. The indirect peripheralcircuitry is for indirectly controlling the operation of the directperipheral circuitry and includes a clock signal generating circuit anda buffer circuit.

At the outermost peripheral portion of the DRAM 1, external terminals(bonding pads) BP are arranged centrally of the long side and the shortside of the DRAM 1. The bonding pads BP are connected to inner leads 3Bthrough bonding wires 4. As the bonding wires 4 there are used aluminum(Al) wires, or there may be used gold (Au) wires, copper (Cu) wires orcoated wires obtained by coating the surfaces of metallic wires such asgold (Au) wires or copper (Cu) wires with an insulating resin. Thebonding wires 4 are bonded by a bonding method which utilizes boththermal compression and ultrasonic vibration.

The inner leads 3B are formed integrally with outer leads 3C. The innerleads 3B, outer leads 3C and tab 3A are cut from a lead frame andmolded. For example, the lead frame is formed using Cu or Fe-Ni (e.g. Nicontent 42%) alloy. To the tab 3A are connected tab supporting leads 3Don the short sides.

The outer leads 3C are numbered and a signal to be applied to each ofthem is defined according to a standard. In FIG. 2, the left upper end,left lower end, right lower end and right upper end leads are No. 1, No.10, No. 11 and No. 20 leads, respectively.

The DRAM 1, tab 3A, bonding wires 4, inner leads 3B and tab supportingleads 3D are molded by a resin molding compound 5. As the resin moldingcompound 5 there is used an epoxy resin with a phenolic curing agent, asilicone rubber and a filler incorporated therein for attaining thereduction of stress. The silicone rubber functions to decrease thethermal expansion coefficient of the epoxy resin. The filler, which isin the form of spherical silicon oxide grains, also functions todecrease the thermal expansion coefficient.

Referring now to FIG. 3 (a chip layout diagram), there is illustrated aschematic construction of the DRAM 1 which is a Semiconductor memorycircuit device in the resin molded type semiconductor device 2.

As shown in FIG. 3, memory cell arrays (MA) 11 are arranged on thesurface of a central portion of the DRAM 1. The DRAM 1 of thisembodiment comprises a total of sixteen memory cell arrays 11 thoughthis does not constitute any limitation. Each memory cell array 11 has acapacity of 256K bits.

Two memory arrays 11 are disposed on both sides of a column addressdecoder circuit (YDEC) 12 and a sense amplifier circuit (SA) 13. Thesense amplifier circuit 13 is constituted by a complementary MISFET(CMOS), and a portion thereof is constituted by an n-channel MISFET. Theremaining portion, i.e., p-channel MISFET, of the sense amplifiercircuit 13, is disposed at an end portion of the memory cell array 11 ina position opposed to the said one portion of the sense amplifiercircuit. From one end side of the sense amplifier circuit 13 thereextend complementary data lines (two data lines) onto the memory cellarray 11. In the DRAM 1 of this embodiment there is adopted a folded bitline method.

A row address decoder circuit (XDEC) 14 and a word driver circuit (WD)15 are disposed at one end on the central side of each of the subdividedsixteen memory cell arrays 11.

A memory mat is constituted by a column address decoder (YDEC) 12, asense amplifier circuit (SA) 13, two memory cell arrays 11 disposed onboth sides of the YDEC 12 and the SA 13, and row address decodercircuits (XDECs) 14 and word driver circuits (WDs) 15. Thus, the DRAM 1of this embodiment is composed of eight memory mats.

The peripheral circuits 12 to 15 which constitute such memory cell matsare called direct peripheral circuits of the DRAM 1.

On the upper side of the DRAM 1 is disposed an upper peripheral circuit16, while on the lower side thereof is disposed a lower peripheralcircuit 17. A middle peripheral circuit 18 is disposed between the fourmemory mats arranged on the upper side of the DRAM 1 and the four memorymats arranged on the lower side. Further, a central peripheral circuit19 is disposed between two of the memory mats arranged on the upper sideof the DRAM 1 and the other two arranged on the same side and it is alsodisposed between two of the memory mats arranged on the lower side andthe other two arranged on the same side. These peripheral circuits 16 to19 are constituted as indirect peripheral circuits of the DRAM 1.

Next, a principal portion of the memory mats and that of the indirectperipheral circuits in the DRAM 1 will be described below with referenceto FIG. 4 (an equivalent circuit diagram of a principal portion).

As shown in FIG. 4, in the memory cell arrays (MAs) 11 of the DRAM 1which adopts the folded bit line method, complementary data lines DL,DL, extend in the column direction. The complementary data lines DL arearranged plural sets in the row direction and connected to the senseamplifier circuits (SAs) 13.

In the memory cell arrays 11, word lines WL extend in the row directionintersecting the complementary data lines DL. The word lines WL arearranged plurally in the column direction. Though not shown in FIG. 4,each word line WL is connected to the row address buffer circuit (XDEC)14 and selected.

A memory cell M for storing a 1 bit of information is disposed at eachof intersecting points of one of complementary data lines DL, DL and theword lines WL. The memory cell M is constituted by a series circuit of amemory cell selecting n-channel MISFET Qs and an information storingcapacitor C.

One semiconductor region of the memory cell selecting MISFET Qs in thememory cell M is connected to the one of complementary data lines DL,DL, while the other semiconductor region thereof is connected to oneelectrode of the information storing capacitor C. A gate electrode isconnected to the word line WL. The other electrode of the informationstoring capacitor C is connected to a fixed potential 1/2 Vcc. The fixedpotential 1/2 Vcc is an intermediate potential between the referencevoltage Vss and power-supply voltage Vcc and is, say, 2.5 V or so. Thefixed potential 1/2 Vcc can decrease the intensity of an electric fieldapplied to the information storing capacitor C and reduce thedeterioration in dielectric strength of the dielectric film.

The sense amplifier circuit 13 is constructed so as to amplify theinformation of the memory cell M which is transmitted through thecomplementary data line DL. The information thus amplified in the senseamplifier circuit 13 is outputted to common data lines I/O, I/O, throughan n-channel MISFET Qy for column switch. The MISFET Qy for columnswitch is controlled by the column address decoder circuit (YDEC) 12.

The common data line I/O is connected to a main amplifier circuit (MAP)1620. The main amplifier circuit 1620 is connected to an externalterminal (Dout) BP for output signal through MISFET (with no symbolaffixed thereto) for switch, output signal lines DOL, DOL, and dataoutput buffer circuit (DoB) 1604. The information of the memory cell Mfurther amplified in the main amplifier circuit 1620 is outputted to theexterior of the DRAM 1 through the signal output line DOL, data outputbuffer circuit 1604 and bonding pad BP.

The following description is now provided about concrete structures ofthe elements which constitute each memory cell M and the peripheralcircuitry (e.g. the sense amplifier circuit and the decoder circuit) inthe DRAM 1. FIG. 5 (a plan view of a principal portion) shows a planestructure of each memory array 11. A sectional structure of the memoryarray 11 and that of the peripheral circuit elements are illustrated inFIG. 1 (a sectional view of a principal portion). The sectionalstructure of the memory cell M shown on the left-hand side of FIG. 1 isof the portion cut along line I--I in FIG. 5, while the right-hand sideof FIG. 1 shows a sectional structure of CMOS which constitutes theperipheral circuitry.

As shown in FIGS. 1 and 5, the DRAM 1 is constituted by a p⁻ -typesemiconductor substrate 20 formed of a single crystal silicon. Thesemiconductor substrate 20 uses (100) crystal plane as an elementforming surface, which is formed at a resistance value of, say, 10 Ω-cmor so.

A p⁻ -type well region 22 is provided on a main surface portion of ann-channel MISFET Qn forming region of the semiconductor substrate 20,while an n⁻ -type well region 21 is provided on a main surface portionof a p-channel MISFET Qp of the semiconductor substrate 20. Thus, theDRAM 1 of this embodiment has a twin-well structure.

On the main surface between semiconductor element forming regions of thewell regions 21 and 22 there is provided an insulating film (fieldinsulating film) 23 for element isolation. In a main surface portion ofthe p⁻ -type well region 22, a p-type channel stopper region 24A isprovided below the insulating film 23 for element isolation. Since thesurface of the p⁻ -type well region 22 is apt to undergo an n-typeinversion, the channel stopper region 24A is provided in the mainsurface portion of at least the p⁻ -type well region.

In the memory cell forming region of the memory cell forming region ofthe memory cell array 11, a p-type semiconductor region 24B is providedin the main surface portion of the p⁻ -type well region 22. The p-typesemiconductor region 24B is provided substantially throughout the wholesurface of the memory array 11. The p-type semiconductor regions 24B isformed by a lateral diffusion of a p-type impurity (B) which forms thep-type channel stopper region 24A, through the same fabrication processand using the same fabrication mask as in the formation of the p-typechannel stopper region 24A. By a lateral diffusion of the p-typeimpurity there is formed the p-type semiconductor region 24Bsubstantially throughout the whole surface of the memory cell M. Thep-type semiconductor region 24B is formed at an impurity concentrationstill higher than that of the p⁻ -type well region 22 whose impurityconcentration is higher than that of the p⁻ -type semiconductorsubstrate 20. The p-type semiconductor region 24B permits an increase ofa threshold voltage of the memory cell selecting MISFET Qs and alsopermits an increase in the amount of an electric charge stored of theinformation storing capacitor C. The p-type semiconductor region 24Balso functions as a potential barrier region against minority carriercreated in the interior of the semiconductor substrate due to the entryof α-ray.

The memory cell selecting MISFET Qs of the memory cell M is constitutedin the main surface portion of the p⁻ -type well region 22 (actually thep-type semiconductor region 24B), as shown in FIGS. 1 and 5. The MISFETQs is constituted within the region defined by the insulating film 23for element isolation and the p-type channel stopper region 24A. Itmainly comprises the p⁻ -type well region 22, a gate insulating film 25,a gate electrode 26 and a pair of n-type semiconductor regions 28 whichare source or drain regions.

The p⁻ -type well region 22 is used as a channel forming region. Thegate insulating film 25 is formed by a silicon oxide film of 15 to 20 nmthickness obtained by oxidizing the main surface of the p⁻ -type wellregion 22.

The gate electrode 26 is provided on the gate insulating film 25 and itis formed at a film thickness of 200 nm or so using a polycrystallinesilicon film deposited by CVD for example, with an n-type impurity (P orAs) being introduced therein for decreasing the resistance value. Thegate electrode 26 may be constituted by a single layer of film of arefractory metal (Mo, Ti, Ta, or W) or film of a refractory metalsilicide (MOSi₂, TiSi₂, TaSi₂, or WSi₂). Also, the gate electrode 26 maybe constituted by a composite film obtained by laminating the saidrefractory metal film or refractory metal silicide film onto apolycrystalline silicon film.

As shown in FIG. 5, the gate electrode 26 is formed integrally with aword line (WL) extending in the row direction. That is, the gateelectrode 26 and the word line 26 are formed by the same conductivelayer. The word line 26 is formed for connection with the gate electrode26 in each of the memory cell selecting MISFETs Qs of plural memorycells M arranged in the row direction.

The gate length of the gate electrode 26 in each memory cell selectingMISFET Qs is larger than the width of the word line 26, as shown in FIG.5. For example, the gate length of the gate electrode 26 is 1.0 μm,while the width of the word line is 0.6 μm.

The n-type semiconductor region 28 is lower in impurity concentrationthan an n⁺ -type semiconductor region 37 of the MISFET Qn whichconstitutes the peripheral circuitry. More particularly, the n-typesemiconductor region 28 is formed by an ion implantation method usingphosphorus of a low impurity concentration lower than 1×10¹⁴ atoms/cm².

The source and drain regions of the memory cell selecting MISFET Qs areconstituted by n-type semiconductor regions 28 and n⁺ -typesemiconductor regions 33A and 41 which will be described later. Thus,the n⁺ -type semiconductor regions 37 formed by an ion implanted layerof As in the source and drain regions of the MISFET which constitutesthe peripheral circuitry is not present in the source and drain regionsof the memory cell selecting MISFET Qs. This is for diminishing theoccurrence of crystal defects caused by the introduction of highimpurity ions and fully remedying crystal defects by heat treatmentafter the introduction of impurity. Since the amount of leakage currentin the pn junction between the n-type semiconductor regions 28 and thep⁻ -type well region 22 is small, the n-type semiconductor regions 28can stably hold the electric charge stored as information in theinformation storing capacitor C.

The n-type semiconductor regions 28 are formed by self-alignment withrespect to the gate electrode 26 and the channel forming region sidethereof is formed at a low impurity concentration, so a memory cellselecting MISFET Qs of an LDD (Lightly Doped Drain) structure isconstituted thereby.

One n-type semiconductor region 28 (the complementary data lineconnection side) of the said memory cell selecting MISFET Qs isconstituted integrally with the n⁺ -type semiconductor region 41, whilethe other n-type semiconductor region 28 (the information storingcapacitor C connection side) is constituted integrally with the n⁺ -typesemiconductor region 33A. The n⁺ -type semiconductor region 41 is formedin the region defined by a connection hole 40A which is for connectionbetween a complementary data line 50 and one n-type semiconductor region28. The n⁺ -type semiconductor region 41 is constituted to prevent theshort-circuit between the complementary data line (50) and the p⁻ -typewell region 22. The n⁺ -type semiconductor region 33A is formed in theregion defined by a connection hole 32 which is for connection between alower electrode layer 33 of the information storing capacitor C of astacked structure which will be described later and the other n-typesemiconductor region 28. The n⁺ -type semiconductor region 33A is formedby diffusing an n-type impurity introduced into the lower electrodelayer 33.

An insulating film 27 is formed on the gate electrode 26 of the memorycell selecting MISFET Qs, and a side wall spacer 29 is provided on theside walls of the gate electrode 26 and the insulating film 27. Theinsulating film 27, having a thickness of about 200 nm, is formed mainlyfor electrical separation between the gate electrode 26 and theelectrodes (especially 33) of the information storing capacitor C formedthereon. The side wall spacer 29 mainly constitutes a memory selectingMISFET Qs of an LDD structure. The insulating film 27 and the side wallspacer 29 are each formed by a silicon oxide film deposited by CVD usinginorganic silane gas and nitrogen oxide gas as a source gases.

The side wall spacer 29 is formed on the side walls of the gateelectrode 26 and the insulating film 27 by the application of RIE(Reactive Ion Etching) after the deposition of silicon oxide film.

The information storing capacitor C of the memory cell M is formed bylaminating a lower electrode layer 33, a dielectric film 34 and an upperelectrode layer 35 successively in this order, as shown in FIGS. 1 and5. It is of a so-called stacked structure (STC).

A portion (central portion) of the lower electrode 33 of the informationstoring capacitor C of a stacked structure is connected to the othern-type semiconductor region 28 of the memory cell selecting MISFET Qs.This connection is performed through a connection hole 31A formed in aninterlayer insulating film 31 and the connection hole 32 defined by theside wall spacer 29. The opening size in the column direction of theconnection hole 32 is defined by the spacing of the gate electrodes 26in memory cell selecting MISFETs Qs and adjacent word lines 26. Thedifference between the opening size of the connection hole 31A and thatof the connection hole 32 is at least larger than the size correspondingto a mask alignment margin in the fabrication process. An end portion(peripheral portion) of the lower electrode layer 33 is extended up toabove the gate electrode 26 and the word line 26.

The interlayer insulating film 31 is formed at a thickness of 500 nm orso by the same insulating film as the underlying insulating film 27 andside wall spacer 29. That is, it is formed by silicon oxide filmdeposited by CVD using inorganic silane gas and nitrogen oxide gas assource gases.

The lower electrode layer 33 is formed by a polycrystalline silicon filmdeposited by CVD for example. Into this polycrystalline silicon film isintroduced at a high concentration an n-type impurity (As or P) whichreduces the resistance value. The lower electrode layer 33 utilizes thestepped shape of the base and the side walls of the connection hole 31Aof the interlayer insulating film 31 to increase the amount of theelectric charge stored in the information storing capacitor C of astacked structure. It has a thickness of about 100 nm.

Thus, by forming the interlayer insulting film 31 thick and forming thelower electrode layer 33 along the side walls of the connection hole 31Ait is made possible to increase the amount of the electric charge storedwhile keeping a plane area of the information storing capacitor C (theside of the lower electrode layer 33 as viewed from above) small.

In the information storing capacitor C of such as structure, an increasein thickness of the interlayer insulating film 31 leads to an increaseof the value of capacitance, but the difference in height between thememory cell array region and the peripheral circuitry region becomeslarger.

In the peripheral circuit region, the interlayer insulating film 31 isnot removed and is allowed to remain. This is a feature of the presentinvention. By so doing it is made possible to reduce the difference inheight between the memory cell array region and the peripheral circuitregion.

In the information storing capacitor C which utilizes the side wall ofthe interlayer insulating film 31 as described above, it is possible toreduce the thickness of the upper and lower electrode layers 35, 33 incomparison with a DRAM of the type wherein a lower electrode layer ismade thick and the side wall thereof is utilized. Therefore, even in astructure wherein the upper and lower electrode layers 35, 33 protrudefrom the connection hole 31A of the interlayer insulating film 31 ontothe same film, it is possible to reduce the difference in height betweenthe memory cell array region and the peripheral circuit region.

The dielectric film 34 is formed by laminating of a silicon nitride filmand a silicon oxide film having a thickness of 1 to 6 nm, the siliconnitride film being deposited at a thickness of 5 to 10 nm onto the lowerelectrode layer 33 by CVD, and the silicon oxide film being obtained byoxidizing the silicon nitride film at a high pressure of 1.5 to 10 atm.The silicon oxide film may be obtained by oxidizing the silicon nitridefilm at a atmospheric pressure. The dielectric film 34 is not limited tosuch a laminate of the silicon nitride film and the silicon oxide film.For example, it may be a tantalum oxide film of a high dielectricconstant.

The upper electrode layer 35 is formed over the lower electrode layer 33through the dielectric film 34. It is formed integrally with the upperelectrode layer 35 of the information storing capacitor 35 in theadjacent memory cells M. A predetermined fixed potential 1/2 Vcc isapplied to the upper electrode layer 35. The upper electrode layer 35,having a thickness of 100 nm, is formed by a polycrystalline siliconfilm deposited by CVD. Into this polycrystalline silicon film isintroduced an n-type impurity (P or As) for reducing the resistancevalue.

As shown in FIGS. 1 and 5, one of complementary data lines (DL, DL) 50is connected to one n-type semiconductor region 28 of the memory cellselecting MISFET Qs in the memory cell M through the connection hole 40Aformed in the interlayer insulating films 39 and 40. The connectionbetween the complementary data line 50 and the n-type semiconductorregion 28 is done through the n⁺ -type semiconductor region 41.

The interlayer insulating film 39 is formed by a silicon oxide film ofabout 200 nm thickness deposited by CVD for example. The interlayerinsulating film 40 is formed by a silicon oxide film (BPSG) of about 500nm thickness containing phosphorus and boron and capable of beingflattened by reflow. The interlayer insulating film 39 is provided forthe purpose of ensuring dielectric strength and preventing the leakageof B and P contained in the overlying interlayer insulating film 40 to aconstituent element (e.g. gate insulating film 25).

The complementary data line 50 is a laminate of a titanium nitride film50A and a tungsten film 50B, of which the underlying titanium nitridefilm 50A is for preventing the reaction of the tungsten film 50B withsilicon in the n-type semiconductor region 28. The thickness of thetitanium nitride film 50A is 100 nm and that of the tungsten film is 500nm.

In place of the combination of the titanium nitride film 50A and thetungsten film 50B there may be used a laminate of a polysilicon film oraluminum film 50A and a tungsten film 50B.

The complementary data line 50 is formed by a first metallic wiringlayer.

Above the complementary data line 50 there extends a word line (WL) 53for shunt in the row direction through an interlayer insulating film 51.The word line 53 for shunt is formed by a second metallic wiring layerand is connected electrically to the word line 26 integral with the gateelectrode 26 of the memory cell selecting MISFET in a predeterminedregion. The word line 53 permits reducing the resistance value of theword line 26 and attaining high-speed information writing and readingoperations.

The second metallic wiring layer is a laminate of three layers which area 100 nm thick titanium-tungsten film 53A, a 500 nm thick aluminum film53B and a 100 nm thick titanium-tungsten film 53C. The titanium-tungstenfilm 53A as a lower layer is for improving the electromigrationresistance and also for preventing the reaction of the tungsten film 50Band the aluminum film 53B. The aluminum film 53B is an alloy filmconsisting of aluminum as the main component, silicon and copper. Thetitanium-tungsten film 53C as an upper layer is provided for loweringthe reflectivity of the second metallic wiring layer and therebydiminishing the diffraction phenomenon in the exposure process.

The interlayer insulating film 51 is a composite film formed bylaminating a silicon oxide film (a deposited insulating film) 51A, asilicon oxide film (an applied insulating film) 51B and a silicon oxidefilm (a deposited insulating film) 51C successively in this order.

The silicon oxide films 51A and 51C as lower and upper layers,respectively, of the interlayer insulating film 51 are each formed bydeposition according to a plasma CVD method. The silicon oxide film 51Bas a middle layer is formed by application according to an SOG (Spin OnGlass) method followed by baking. The middle silicon oxide film 51B isformed for the purpose of flattening the surface of the interlayerinsulating film 51 and it is formed so as to be buried into only theconcave of the stepped portion by the application, subsequent baking andfurther applying an etching treatment to the whole surface. The middlesilicon oxide film 51B is removed by etching so as not to remain in theconnection (connection hole 52) between the first wiring layer (50) andthe second wiring layer (53). In other words, the silicon oxide film 50Bas a middle layer is formed so as not to be exposed to the side wall ofthe connection hole 52 in order that the corrosion of the aluminum filmof the wiring (each of 50 and 53) caused by the moisture contained inthe film 50B can be diminished.

Over the word line 53 for shunt there is formed a passivation film 54which is a silicon nitride film formed by a plasma CVD method and havinga thickness of about 1 μm.

The CMOS which constitutes the peripheral circuitry of the DRAM 1 isformed as shown on the right-hand side of FIG. 1. The n-channel MISFETQn of the CMOS is formed in the main surface portion of the p⁻ -typewell region 22 within the region surrounded by an insulating film 23 forelement isolation and a p-type channel stopper region 24A. The n-channelMISFET Qn mainly comprises the p⁻ -type well region 22, gate insulatingfilm 25, gate electrode 26, a pair of n-type semiconductor regions 28which are source and drain regions, and a pair of n⁺ -type semiconductorregions 37.

The p⁻ -type well region 22, gate insulating film 25, gate electrode 26and n-type semiconductor regions 28 are formed by the same fabricationprocess and have substantially the same functions as in the foregoingmemory cell selecting MISFET Qs. That is, the n-channel MISFET Qn is ofLDD structure.

The n⁺ -type semiconductor regions 37 of a high impurity concentrationare constituted to reduce the resistance value of source region and thatof drain region. The regions 37 are each formed while being defined by aside wall spacer 29 which has been formed by self-alignment along theside wall of the gate electrode 26, and each formed by self-alignmentwith respect to the gate electrode 26 and the side wall spacer 29.

To the n⁺ -type semiconductor region 37 used as the source region isconnected a wiring line 50 to which is applied the reference voltage Vssthrough a connection hole 40A formed in interlayer insulating films 31,39 and 40, while to the n⁺ -type semiconductor region 37 used as thedrain region is connected a line 50 for output signal through theconnection hole 40A formed in the interlayer insulating films 31, 39 and40. The n⁺ -type semiconductor regions 37 and the wiring lines 50 areelectrically connected to each other through an n⁺ -type semiconductorregion 41 formed within the region defined by the connection hole 40A.The wiring line 50 is formed by the same electroconductive layer as thatof the foregoing complementary data line 50.

The p-channel MISFET Qp of the CMOS is constituted in a main surfaceportion of an n⁻ -type well region 21 in the region surrounded by aninsulating film 23 for element isolation. The p-channel MISFET Qp mainlycomprises the n⁻ -type well region 21, gate insulating film 25, gateelectrode 26, a pair of p-type semiconductor regions 30 which are sourceand drain regions, and a pair of p⁺ -type semiconductor regions 38.

The n⁻ -type well region 21, gate insulating film 25 and gate electrode26 have substantially the same functions as in the memory cell selectingMISFET Qs and n-channel MISFET Qn.

The p-type semiconductor regions 30 of a low impurity concentrationconstitutes the p-channel MISFET Qp of LDD structure. To the p⁺ -typesemiconductor region 38 used as the source region is connected a wiringline 50 to which is applied the power-supply voltage Vcc through aconnection hole 40A formed in interlayer insulating films 31, 39 and 40,while to the p⁺ -type semiconductor region 38 used as the drain regionis connected a wiring line 50 for output signal formed with the samelayer as the foregoing complementary data line 50 through a connectionhole 40A which is formed in the interlayer insulating films 31, 39 and40. To this output signal line 50 is connected an overlying line 53through a connection hole 52. The line 53 is formed by the sameelectroconductive layer as the foregoing word line 53 for shunt. Oncondition that the interlayer insulating film 31 by which thecapacitance of the information storing capacitor C is increased,remained in peripheral circuit region, a connection hole 40A is formedin interlayer insulating films 31, 39, 40 so process margin for theconnection hole 40A can be improved.

Thus, the wiring line 50 as the first metallic wiring layer is subjectedto patterning while the interlayer insulating film 31 provided forincreasing the capacitance of the information storing capacitor C in thememory cell array region is allowed to remain in the peripheral circuitregion, so it is possible to form the wiring lines 50 in the memory cellarray region and the lines 50 in the peripheral circuit regionsimultaneously with a high accuracy. This is because the interlayerinsulating film 31 is allowed to remain in the peripheral circuit regionand hence the difference in height below the first metallic wiring layercan be kept to a value not larger than 0.75 from a predeterminedreference position even at the portions where the difference in heightis the largest in both the memory cell array region and the peripheralcircuit region.

The said portions where the difference in height is the largest are theportion where the word line 26, interlayer insulating film 31 and upperand lower electrode layers 35, 33 in the memory cell array regionoverlap one another and the portion present above the source or drainregion in the peripheral circuit region.

In the DRAM 1 (semiconductor memory circuit device) of the presentinvention, the difference in the distance from the back of thesemiconductor substrate 20 up to the first metallic wiring layer in boththe memory cell array region and the peripheral circuit region can bekept within 1.5 μm, so the formation of the connection hole 40A in theinterlayer insulating films 31, 39, 40 and that of the line 50 as thefirst metallic wiring layer can be done with a high accuracy.Consequently, it is possible to improve the integration density.

Further, since the difference in height between the memory cell arrayregion and the peripheral circuit region can be reduced at the time offormation of the second metallic wiring layer, it is possible to effectthe formation of the line 53 as the second metallic wiring layer on thefirst metallic wiring layer through the interlayer insulating film 51also with a high accuracy.

Next, a concrete fabrication method for the DRAM 1 will be describedbelow with reference to FIGS. 6 to 14.

There is first provided a p⁻ -type semiconductor substrate 20 formed ofa single crystal silicon, and there are formed a p⁻ -type well region 22and an n⁻ -type well region 21, then gate electrodes 26 and interlayerinsulating films 27 are formed on the surface of the p⁻ -typesemiconductor substrate 20. The processes up to this stage are describedin detail in U.S. Ser. No. 497,537 filed Mar. 20, 1990, assigned toHitachi, Ltd.

[Semiconductor Region Forming Process]

Then, in a memory cell array region and a peripheral circuit region,n-type semiconductor regions 28 of a low impurity concentration areformed in an n-channel MISFET Qn forming region, as shown in FIG. 6.More specifically, the n-type semiconductor regions 28 are formed by ionimplantation of phosphorus at an impurity concentration of 10¹³atoms/cm² or so using an energy of 80 to 120 KeV by self-alignment withrespect to the gate electrodes 26.

Next, p-type semiconductor regions 30 of a low impurity concentrationare formed in a p-channel MISFET Qp forming region in the peripheralcircuit region. More specifically, the p-type semiconductor regions 30are formed by ion implantation of BF₂ (or B) having an impurityconcentration of 10¹³ atoms/cm² or so, using an energy of 60 to 100 KeV,by self-alignment with respect to the gate electrodes 26.

Then, side wall spacers 29 are formed on side walls of each of the gateelectrodes 26, word lines 26 and the overlying interlayer insulatingfilms. The side wall spacers 29 can be formed by deposition of a siliconoxide film followed by anisotropic etching such as RIE.

Next, n-type semiconductor regions 37 of a high impurity concentrationare formed in the n-channel MISFET Qn forming region in the peripheralcircuit region. More specifically, the n-type semiconductor regions 37are formed by ion implantation of As having an impurity concentration of10¹⁵ to 10¹⁶ atoms/cm², using an energy of 70 to 90 KeV, byself-alignment with respect to the gate electrodes 26 and the side wallspacers 29.

The n-type semiconductor regions 37 are not formed at both ends of thegate electrodes 26 (word lines 26) of the memory cell selecting MISFETQs in the memory cell array region. The ion implantation for n-typesemiconductor region 37 is done by using photo-resist mask covering thememory cell array region. This is because a crystal defect occurs on thesurface of the p⁻ -type semiconductor substrate 20 in this ionimplantation process and the leakage of electric charge results.

Then, p-type semiconductor regions 38 of a high impurity concentrationare formed in the p-channel MISFET Qp forming region in the peripheralcircuit region. More specifically, the p-type semiconductor regions 38are formed by ion implantation of BF₂ having an impurity concentrationof 10¹⁵ atoms/cm² or so, using an energy of 60 to 90 KeV, byself-alignment with respect to the gate electrodes 26 and the side wallspacers 29.

[Interlayer Insulating Film Forming Process]

Next, as shown in FIG. 7, an interlayer insulating film 31 is formedthroughout the whole surface of the substrate, including the uppersurfaces of the interlayer insulating films 27 and side wall spacers 29,and connection holes 31A are formed in information storing capacitor Cforming regions.

The interlayer insulating film 31 is a silicon oxide film or a siliconnitride film formed by CVD and having a thickness of about 500 nm. Thefilm 31 is used as an etching stopper layer at the time of formingelectrode layers of each information storing capacitor C of a stackedstructure in the memory array region and the peripheral circuit region.It is also used for increasing the capacitance of the informationstoring capacitor C by utilizing the side faces of the interlayerinsulating film 31 in the connection holes 31A.

[Information Storing Capacitor Forming Process]

Next, as shown in FIG. 8, a lower electrode layer 33 of each informationstoring capacitor C is formed in each connection hole 31A formed in theinterlayer insulating film 31. More specifically, the lower electrodelayer 33 is formed by introducing an n-type impurity, e.g. P, into apolycrystalline silicon film deposited at a thickness of 100 nm, or soby CVD followed by the application of the photolithography or etchingtechnique. The lower electrode layer 33 is patterned so that endportions thereof extend onto the interlayer insulating film 31.

In one of source and drain regions of the memory cell selecting MISFETQs there is formed an n⁺ -type semiconductor region 33A by diffusion ofthe n-type impurity from the lower electrode layer 33 through aconnection hole 32 defined by the side wall spacers 29.

Then, as shown in FIG. 9, a dielectric film 34 is formed throughout thewhole substrate surface, including the upper surfaces of the lowerelectrode layers 33 of the information storing capacitors C. Thedielectric film 34 has a two-layer structure comprising a siliconnitride film and a silicon oxide film. The silicon nitride film isformed at a thickness of 5 to 10 nm by deposition according to a CVDmethod, while the silicon oxide film is formed at a thickness of 1 to 6nm by placing the surface of the silicon nitride film in an oxygenatmosphere under the conditions of 1.5 to 10 atm. and 800° to 1,000° C.As a result, the thickness of the silicon nitride film becomes 4 to 8nm.

Next, as shown in FIG. 10, a polycrystalline silicon film is depositedthroughout the whole substrate surface at a thickness of 100 nm or so byCVD. An n-type impurity, e.g. P, is introduced into this polycrystallinesilicon film.

Then, an etching mask 67 is formed in the region forming an informationstoring capacitor. For example, the etching mask 67 is a photoresistfilm. Thereafter, using the etching mask 67, a polycrystalline siliconfilm which constitutes upper electrode layers 35, and the dielectricfilm 34, are etched successively.

[Interlayer Insulating Film Forming Process]

Next, as shown in FIG. 11, interlayer insulating films 39 and 40 arelaminated successively onto the whole substrate surface, including thesurfaces of the constituent elements of the DRAM 1. The interlayerinsulating film 39 as a lower layer is a silicon oxide film deposited ata thickness of 200 nm or so by CVD, while the interlayer insulating film40 as an upper layer is a silicon oxide film (BPSG film) deposited at athickness of 500 nm or so by CVD and containing an impurity (P and B).The surface of the upper interlayer insulating film 40 is flattened byreflow in a nitrogen gas atmosphere at a temperature of about 900° to1,000° C. The lower interlayer insulating film 39 prevents the entry ofthe impurity from the upper interlayer insulating film into theunderlying MISFET portion.

[Connection Hole Forming Proces]

Next, as shown in FIG. 12, connection holes 40A are formed in theinterlayer insulating films 39 and 40 by anisotropic etching.

Then, in the memory cell selecting MISFET Qs and the n-channel MISFET Qnwhich constitutes the peripheral circuitry, an n-type impurity isintroduced into main surface portions of the n-type semiconductorregions 28 and n⁺ -type semiconductor regions 37 through the connectionholes 40A to thereby form n⁺ -type semiconductor regions 41. Morespecifically, the n⁺ -type semiconductor regions 41 are formed by ionimplantation of As having an impurity concentration of 10¹⁵ atoms/cm²,using an energy of 110 to 130 KeV. At this time, the p-channel MISFET Qpforming region is covered with a photoresist film for example.

Since the interlayer insulating film 31 is present also in theperipheral circuit region at the time of formation of the connectionholes 40A, the difference in height between the memory cell array regionand the peripheral circuit region is smaller than 1.5 μm the exposureprocess for forming the connection holes 40A, therefore, both the memorycell array region and the peripheral circuit region can be placedsimultaneously within the depth of focus of the aligner and so can besubjected to exposure at a time.

Further, since the difference in height between the memory cell arrayregion and the peripheral circuit region is small, the processingaccuracy for the connection holes 40A in the memory cell array regionand that for the connection holes 40A in the peripheral circuit regioncan be made substantially the same, so it is possible to take a largeprocessing margin.

[Wiring Process]

Next, as shown in FIG. 13, there are formed wiring lines 50 as firstmetallic wiring layers in contact with the n⁺ -type semiconductorregions and the p⁺ -type semiconductor regions 38 and extending onto theinterlayer insulating film 40. The wiring lines 50 are each a laminatefilm of TiN and W and are used as complementary data lines (DL) 50 inthe memory cell array region. The TiN film is formed at a thickness ofabout 100 nm by sputtering, and the W film is formed at a thickness ofabout 500 nm also by sputtering. Both photolithography technique andetching technique are used for the formation of the wiring lines 50.

Since the interlayer insulating film 31 is present in the peripheralcircuit region, the difference in height between the memory cell arrayregion and the peripheral circuit region at the time of patterning ofthe wiring lines 50 is smaller than 1.5 μm. In the exposure process forpatterning of the wiring lines 50, therefore, both the memory cell arrayregion and the peripheral circuit region can be placed simultaneouslywithin the depth of focus of the aligner and so can be subjected toexposure at a time.

Moreover, since the processing accuracy for the wiring lines 50 in thememory cell array region and that in the peripheral circuit region canbe made substantially the same, it is possible to take a largeprocessing margin.

Further, since the difference in height between the memory cell arrayregion and the peripheral circuit region is small, it is possible toprevent the breakage at a stepped portion of the lines 50, e.g. datalines, extending from the memory cell array region continuously to theperipheral circuit region.

Thereafter, as shown in FIG. 1, an interlayer insulating film 51, a line53 as the second metallic wiring layer, and a passivation film 54, areformed to complete the semiconductor memory circuit device of thisembodiment.

(Embodiment II)

According to another embodiment II of the present invention, as shown inFIG. 14, the capacitance of the information storing capacitor C in eachmemory array in the DRAM of embodiment I can be increased.

This embodiment II is different from the previous embodiment I in theshape of the interlayer insulating film 31 provided in the memory cellarray region. In the embodiment I, as shown in FIG. 7, the connectionhole 31A is formed only in the source or drain region of the memory cellselecting MISFET Qs to which the information storing capacitor C isconnected. On the other hand, in this embodiment II, an interlayerinsulating film 31 is allowed to remain in the form of a ring so as tosurround the source or drain region of the memory cell selecting MISFETQs to which the information storing capacitor C is connected.

The lower and upper electrode layers 33 and 35 of the informationstoring capacitor C are formed so as to cover both side walls of thering-like interlayer insulating film 31.

Thus, in the memory cell of this embodiment, since the informationstoring capacitor C is formed along both side walls of the interlayerinsulating film 31, it is possible to reduce the occupied area thereofand realize a large capacitance.

Also in the memory cell of such a structure, the same effect as in theembodiment I can be obtained by allowing the interlayer insulating film31 to remain in the peripheral circuit region.

The materials and film thicknesses of the constituent layers of DRAM 1according to this embodiment, as well as how to produce them, are thesame as in the embodiment I.

Both embodiments I and II are examples of memory cells of the type whichutilizes the side walls of the interlayer insulating film 31 forenlarging the capacitance value of the information storing capacitor C.

As another memory cell of a stacked structure there is a memory cell ofthe type in which the lower electrode layer 33 is extended verticallyupwards to increase the capacitance. The following is a furtherembodiment of the present invention applied to such a type of a memorycell.

(Embodiment III)

In a DRAM according to this embodiment III, as shown in FIG. 15, aninterlayer insulating film is thin and instead a lower electrode layer33 is formed thick in comparison with the DRAM of embodiment I. Further,an interlayer insulating film 55 for diminishing the difference inheight between the memory cell array region and the peripheral circuitregion is provided in only the peripheral circuit region.

In a memory cell of the type wherein the lower electrode layer 33 isextended vertically upwards to increase the capacitance, allowing theinterlayer insulating film 31 to remain in the peripheral circuit regiondoes not directly lead to reducing the difference in height between thememory cell array region and the peripheral circuit region.

Therefore, the interlayer insulating film 55 for diminishing thedifference in height is provided in only the peripheral circuit region.The thickness of this interlayer insulating film 55 corresponds to thesum of the thicknesses of the lower electrode layer 33, dielectric film34 and upper electrode layer 35 of the information storing capacitor C.

The following description is now provided about the portion of the DRAM1 illustrated in FIG. 15 which portion is different from the DRAM ofembodiment I shown in FIG. 1.

In this embodiment III, the thickness of the interlayer insulating 31 is100 nm, that of the lower electrode layer 33 is 500 nm and that of theinterlayer insulating film 55 is 500 nm.

The interlayer insulating film 55 may be provided between or overinterlayer insulating films 39 and 40 if only it is located below thewiring line 50 as the first metallic wiring layer.

Now, how to fabricate the DRAM 1 of this embodiment III will bedescribed below with reference to FIGS. 16 to 20.

[Semiconductor Region Forming Proces]

As shown in FIG. 16, in the memory cell array region and the peripheralcircuit region, n-type semiconductor regions 28 of a low impurityconcentration are formed in an n-channel MISFET Qn forming region, whilep-type semiconductor regions 30 of a low impurity concentration areformed in a p-channel MISFET Qp forming region in the peripheral circuitregion. This process corresponds to the process shown in FIG. 6 inembodiment I. How to form the n- and p-type semiconductor regions 28 and30 is the same as in embodiment I.

In this embodiment III, n⁺ -type semiconductor regions 37 and p⁺ -typesemiconductor regions 38 are not formed yet at this stage in theperipheral circuit region.

[Interlayer Insulating Film Forming Process)

Next, as shown in FIG. 17, interlayer insulating films 31 are formed inthe same manner as in FIG. 7, provided the thickness thereof is 100 nm,thinner than that in embodiment I.

[Information Storing Capacitor Forming Process]

Next, a lower electrode layer 33, a dielectric film 34 and an upperelectrode layer 35 of each information storing capacitor C are formedsuccessively, as shown in FIGS. 18 and 19. These are formed in the samemanner as in embodiment I, provided the thickness of the lower electrodelayer 33 is 500 nm. Further, although in the process of FIG. 10described in embodiment I the polycrystalline silicon film whichconstitutes the upper electrode layer 35 and the dielectric film 34 areetched successively using the etching mask 67, the interlayer insulatingfilms 31 are also etched in this embodiment III.

[Semiconductor Region Forming Process]

Next, in the peripheral circuit region, n⁺ - and p⁺ -semiconductorregions are formed in the n- and p-channel MISFETs Qn and Qp. How toform them is as already explained in connection with the process of FIG.6 in embodiment I.

[Interlayer Insulating Film Forming Process]

Then, as shown in FIG. 20, an interlayer insulating film 55 is formed inonly the peripheral circuit region. The interlayer insulating film 55 isa silicon oxide film or a silicon nitride film formed by CVD, having athickness almost equal to the sum of the thicknesses of the lowerelectrode layer, dielectric film and upper electrode layer of theinformation storing capacitor C. In this embodiment, the thickness ofthe interlayer insulating film 55 is 600 nm.

By providing the interlayer insulating film 55 in the peripheral circuitregion it is made possible to diminish the difference in height betweenthe memory cell array region and the peripheral circuit region.

Thereafter, as shown in FIG. 15, interlayer insulating films 39, 40 line50 as the first metallic wiring layer, interlayer insulating film 51,line 53 as the second metallic wiring layer, and passivation film 54,are formed successively to complete the DRAM 1 of this embodiment III.In this embodiment, the interlayer insulating film 55 may be formedbetween or after the interlayer insulating films 39 and 40.

The interlayer insulating film 55 may be formed before the formation ofthe lower electrode layer 33 of the information storing capacitor C andin this case it is not necessary to form the interlayer insulating film31.

The n⁺ -type semiconductor regions 37 and p⁺ -type semiconductor regions38 must be formed before the formation of the interlayer insulatingfilms 39, 40 and 55.

In the embodiments I to III, the difference in height between the memorycell array region and the peripheral circuit region means the differencein height before the formation of the first metallic wiring layer whichoverlies the information storing capacitor C, that is, after theformation of the interlayer insulating film 40.

The peripheral circuit region means the other region than the memorycell array region, including a bonding pad BP forming region in additionto direct and indirect peripheral circuits.

Although the present invention has been described above concretely interms of embodiments of the invention, it is to be understood that thepresent invention is not limited to those embodiments and that variousmodifications may be made within the scope not departing from the gistof the invention. For example, the present invention is applicable to amicrocomputer which incorporates a DRAM therein, or a SRAM.

The following is a brief explanation of the effects obtained by typicalinventions out of those disclosed herein.

(1) It is possible to improve the integration density of thesemiconductor memory circuit device.

(2) It is possible to improve the product yield of the semiconductormemory circuit device.

(3) It is possible to improve the electrical reliability of thesemiconductor memory circuit device.

(4) It is possible to shorten the fabrication process for thesemiconductor memory circuit device.

What is claimed is:
 1. A method of fabricating a semiconductor memorycircuit device having an array of memory cells arranged in matrix form,each of said memory cells including a first MISFET having a gate, asource and a drain and an information storing capacitor having first andsecond electrodes and a dielectric film formed between the first andsecond electrodes, and the device also having peripheral circuitryconstituted by a plurality of second MISFETs, each second MISFET havinga gate, a source and drain, comprising the steps of:(a) providing asemiconductor substrate having a first region for forming said memorycells and a second region for forming said peripheral circuitry; (b)forming said first MISFET in said first region and forming the secondMISFET in said second region; (c) forming a first insulating film oversaid first and second MISFETs, said first insulating film having a firstthrough-hole, defined by a sidewall of the first insulating film, insaid first region, and a part of said sidewall being arranged above saidgate electrode of said first MISFET; (d) forming said first electrode,said dielectric film and said second electrode in said firstthrough-hole and along said sidewall of said first through-hole; (e)forming a second insulating film over said first insulating film in saidfirst region and in said second region; (f) forming a secondthrough-hole in said first and second insulating films in said secondregion; and (g) forming a first conductive film on said secondinsulating film in said first region and in said second region; and (h)patterning said first conductive film so as to form a first wiring insaid first region and a second wiring in said second region, whereinsaid second electrode extends over said first insulating film in saidfirst region.
 2. A method of fabricating a semiconductor memory circuitdevice according to claim 1, wherein the step of forming said firstelectrode includes a step of depositing a polysilicon film.
 3. A methodof fabricating a semiconductor memory circuit device according to claim1, wherein the step of forming said dielectric film includes a step ofdepositing a silicon nitride film.
 4. A method of fabricating asemiconductor memory circuit device according to claim 1, wherein thestep of forming the first conductive film includes a step of depositinga tungsten film.
 5. A method of fabricating a semiconductor memorycircuit device according to claim 1, wherein the first insulating filmis a silicon oxide film or a silicon nitride film, formed by chemicalvapor deposition.
 6. A method of fabricating a semiconductor memorycircuit device according to claim 1, wherein said first insulating filmis an etch stopper layer when forming the first and second electrodes.7. A method of fabricating a semiconductor memory circuit device havingan array of memory cells arranged in matrix form, each of said memorycells including a first MISFET having a gate, a source and a drain andan information storing capacitor having first and second electrodes anda dielectric film formed between the first and second electrodes, thedevice also having peripheral circuitry constituted by a plurality ofsecond MISFETs, each second MISFET having a gate, a source and drain,comprising the steps of:(a) providing a semiconductor substrate having afirst region for forming said memory cells and a second region forforming said peripheral circuitry; (b) forming the first MISFETs in saidfirst region and forming the second MISFETs in said second region; (c)forming a first insulating film over said first and second MISFETs, saidfirst insulating film having first through-holes in said first region,each of said first through-holes being defined by a sidewall of saidfirst insulating film, a part of said sidewall being arranged above saidgate electrode of said first MISFET; (d) forming said first electrodesin each of said first through-holes and along said sidewall of saidfirst through-hole; (e) forming said dielectric film and said secondelectrode in said first through-holes and along said sidewall of saidfirst through-holes, said dielectric film and said second electrodeextending over said first insulating film between said firstthrough-holes; (f) forming a second insulating film over said firstinsulating film in said first region and in said second region; (g)forming second through-holes in said first and second insulating filmsin said second region; and (h) forming a first wiring in said firstregion and a second wiring in said second region, wherein said firstelectrodes formed in said first through-holes are electricallyindependent of each other.
 8. A method of fabricating a semiconductormemory circuit device according to claim 7, wherein said step (d)includes the steps of:forming a first conductive film in said firstthrough-holes and along said sidewall of said first through-holes andover said first insulating film; and removing said first conductive filmover said first insulating film in said first and second regions andleaving said first conductive film in said first through-holes so as toform said first electrodes.
 9. A method of fabricating a semiconductormemory circuit device according to claim 8, wherein the step of formingsaid first conductive film includes a step of depositing a polysiliconfilm.
 10. A method of fabricating a semiconductor memory circuit deviceaccording to claim 7, wherein the step of forming said dielectric filmincludes depositing a silicon nitride film.
 11. A method of fabricatinga semiconductor memory circuit device according to claim 7, wherein thestep of forming the first wiring and the second wiring includesdepositing a tungsten film.
 12. A method of fabricating a semiconductormemory circuit device according to claim 7, wherein the first insulatingfilm is a silicon oxide film or a silicon nitride film, formed bychemical vapor deposition.
 13. A method of fabricating a semiconductormemory circuit device according to claim 7, wherein said firstinsulating film is an etch stopper layer when forming the first andsecond electrodes.
 14. A method of fabricating a semiconductor memorycircuit device according to claim 1, wherein another second through-holeis formed in the first and second insulating films, in the first region.15. A method of fabricating a semiconductor memory circuit deviceaccording to claim 14, wherein said second through-hole and said anothersecond through-hole are formed simultaneously.
 16. A method offabricating a semiconductor memory circuit device according to claim 14,wherein said second through-hole is formed so as to provide electricalconnection to a source or drain of the second MISFET, and said anothersaid through-hole is formed so as to provide electrical connection to asource or drain of the first MISFET.
 17. A method of fabricating asemiconductor memory circuit device according to claim 1, wherein saidsecond through-hole is formed so as to provide electrical connection toa source or drain of the second MISFET.
 18. A method of fabricating asemiconductor memory circuit device according to claim 7, wherein othersecond through-holes are formed in the first and second insulatingfilms, in the first region.
 19. A method of fabricating a semiconductormemory circuit device according to claim 18, wherein the secondthrough-holes and the other second through-holes are formedsimultaneously.
 20. A method of fabricating a semiconductor memorycircuit device according to claim 18, wherein said second through-holesare formed so as to provide electrical connection to a source or drainof the second MISFETs, and the other second through-holes are formed soas to provide electrical connection to a source or drain of the firstMISFETs.
 21. A method of fabricating a semiconductor memory circuitdevice according to claim 7, wherein said second through-holes areformed so as to provide electrical connection to a source or drain ofthe second MISFETs.